Our FE Series was originally designed for IC sales engineers as an economical, reliable, and user-friendly method of testing high speed packages on product demo boards.  They fast became popular as a cost-effective means of product evaluation for “hands-on” bench test applications are sent out on demonstration boards to potential customers.

The FE Series is made on two economical platform structures to handle a wide variety of IC packages.   See the details below:      

The “Clamping-lid” also called “Device Clamp” shown in the upper and middle photos on the right is a Direct Contact socket typically used for gull wing style packages.   It also may be used in conjunction with ConectFlex® for grounding the belly pad. 

The “Twist-lid” shown in the lower photo on the right, is used in conjunction with ConectFlex® high frequency membrane as its contact mechanism.  This socket is used for testing packages with 1:1 terminations such as BGA, QFN, and “land” or “pad” terminated packages. 

"ConectFlex is a registered trademark of Conectl Test"