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| Overview |
Interface Modules
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In the past two decades RS Tech has fabricated hundreds of different interface modules for a great number of test hardware applications. With our vast experience we have found that even while serving a wide range of applications, interconnect modules tend to share similar design characteristics. The photos on this page were chosen to illustrate some basic characteristics that modules share. Specifying the appropriate contact mechanism is critical to a reliable product solution. There are many contact forms to choose from in specifying the proper contact or contact combination to perform the job. There are essentially two methods of making contact: 1) LIF (low insertion force) mechanisms such as receptacle or socket pins, typically used to mate peripheral hardware connectors or components to circuit boards. 2) Spring probes or similar compression type contact mechanisms are typically used in board-to-board applications and the like. One of these methods, or a combination of the two, must also be considered in creating a reliable and consistent electrical junction between the mated surfaces. As you review the illustrations below do not impose boundaries or restrictions on your interface solution. We fully understand the complexities of hardware interface. We can apply design and manufacturing techniques learned through years of experience to create your hardware solutions, however complicated it may seem. RST has made a number of various interface ring assemblies. While most requirements are for plastic bodies, we have made several high-performance rings and block assemblies using copper or aluminum bodies with insulator sleeves surrounding the contacts. We have access to a vast library of spring probe contacts, in both single and double-ended tips, and an assortment of tip configurations to contact any surface. These products may be built in either ring or block configurations, as individual interface modules, or as fully integrated systems.
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